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Lenovo

Lenovo SR670-V2 | 3U dual-socket Intel Xeon Scalable Gen3 | GPU-optimized up to 8x GPUs (SXM/PCIe) | 32x DIMM DDR4-3200, Optane PMem support | NVMe bays | PCIe 4.0 | OCP 3.0 | Redundant PSUs | XClarity mgmt

SKU:SR670-V2

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Description

Next-gen GPU compute platform engineered for large-scale AI/ML, HPC, and advanced visualization. Dual 3rd Gen Xeon Scalable CPUs, dense DDR4 with Optane PMem support, PCIe 4.0, and options for up to eight accelerators (SXM or PCIe) deliver exceptional performance, bandwidth, and flexibility. XClarity management enables efficient deployment and orchestration.

Features

- Scalable design for up to eight data center GPUs
- PCIe 4.0 architecture for next-gen accelerators and NVMe
- Optane PMem support for large-memory and fast restart workloads
- Flexible I/O with OCP 3.0 and multiple PCIe risers
- Service-friendly hot-swap drives and PSUs
- Enterprise manageability with XClarity and Redfish automation

Warranty

All products sold by XS Network Tech include a 12-month warranty on both new and used items. Our in-house technical team thoroughly tests used hardware prior to sale to ensure enterprise-grade reliability.

All technical data should be verified on the manufacturer data sheets.

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FAQs

Technical Specifications

FAQs

Q: Does it support NVIDIA A100 or A30 GPUs?
A: Yes, configurations are available with data center GPUs; compatibility depends on SXM vs PCIe topology and power budget.

Q: Can I combine Optane PMem with DDR4?
A: Yes, mixed memory modes are supported on compatible CPUs and OSes; consult the configuration guide for ratios and modes.

Q: What network bandwidth is supported?
A: OCP 3.0 and PCIe slots support 10/25/40/100GbE adapters; higher bandwidth options may be available depending on NICs.

Q: Is NVLink supported?
A: NVLink is available with supported SXM GPU configurations; topology depends on the chosen GPU tray/backplane.

Q: Are rails and bezels included?
A: These are model-dependent accessories; verify inclusion or request the appropriate FRUs when ordering.

Technical Specifications

- Form factor: 3U rack, high-density GPU design
- CPU: Up to 2x Intel Xeon Scalable (3rd Gen, Ice Lake)
- Memory: 32x DDR4-3200 DIMM slots; Intel Optane PMem 200 support (config-dependent)
- GPU options: Up to 8x accelerators (SXM or PCIe, model-dependent)
- Interconnect: PCIe 4.0 for NICs, NVMe, and accelerators
- Storage: High-speed NVMe plus SAS/SATA options with modular backplanes
- RAID: Hardware RAID 0/1/10/5/6 (controller-dependent)
- Networking: OCP 3.0 NIC slot with 10/25/100GbE options; additional PCIe NICs supported
- Power: High-capacity redundant hot-swap PSUs sized for multi-GPU
- Management: XClarity Controller (XCC), Redfish, remote console/media
- Security: TPM 2.0, Secure Boot, firmware guard features

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