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HPE

HPE P48905-B21 | Gen11 High‑Performance Heat Sink Kit | for DL3xx & DL560 | supports high‑TDP CPUs

SKU:P48905-B21

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Description

Enhanced thermal solution for Gen11 DL3xx and DL560 servers to support high‑TDP processors and sustained boost frequencies. The kit improves heat dissipation under heavy compute loads and high ambient conditions, helping maintain performance stability during sustained workloads.

Features

Improved thermal headroom for high‑TDP processors
- Supports sustained turbo and performance stability
- Platform‑validated fit for DL3xx and DL560 Gen11
- Straightforward installation with platform guides

Warranty

All products sold by XS Network Tech include a 12-month warranty on both new and used items. Our in-house technical team thoroughly tests used hardware prior to sale to ensure enterprise-grade reliability.

All technical data should be verified on the manufacturer data sheets.

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FAQs

Technical Specifications

FAQs

Q: How many heat sink kits do I need?
A: One kit is required per CPU socket populated. Dual‑CPU servers require two kits.

Q: Is thermal interface material included?
A: The solution uses platform‑approved TIM; follow the service guide for TIM handling and application.

Q: When is this kit recommended over a standard heat sink?
A: When configuring high‑TDP processors, sustained turbo performance, dense memory, or higher ambient temperatures.

Q: Does this kit change supported CPU models?
A: It does not change CPU compatibility; it enables proper cooling for supported high‑TDP CPUs.

Technical Specifications

Compatibility: ProLiant DL3xx Gen11 and DL560 Gen11 platforms
- Use case: Required/recommended for high‑TDP CPUs and performance configurations
- Contents: High‑performance heat sink with mounting hardware
- Thermal design: Optimized fin stack for increased airflow and dissipation
- Placement: CPU socket location(s) per server configuration
- Installation: Tool‑assisted install; follow platform service guide

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