Cisco

Cisco UCSC-HSLP-C225M6 | low-profile heatsink | UCS C225 M6 | 1U/2U LFF/SFF GPU SKU | passive CPU cooling

SKU:UCSC-HSLP-C225M6

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Description

Platform-matched passive CPU heatsink for UCS C225 M6 servers, sized for clearance in GPU-configured builds and optimized for front-to-back rack airflow across 1U/2U LFF/SFF chassis. Ideal as a replacement or for build-outs where correct thermal components are required for validated operation.

Features

- Platform-validated fit for UCS C225 M6
- Low-profile design preserves clearance near GPU/PCIe risers
- Passive, front-to-back airflow optimization for rack environments
- Direct replacement for correct thermal compliance in GPU SKU builds
- Simple installation using standard platform retention

Warranty

All products sold by XS Network Tech include a 12-month warranty on both new and used items. Our in-house technical team thoroughly tests used hardware prior to sale to ensure enterprise-grade reliability.

All technical data should be verified on the manufacturer data sheets.

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FAQs

Technical Specifications

FAQs

Q: Does this include thermal compound?
A: Thermal compound is not typically included. Apply new compound per the server installation guide during fitment.

Q: Is it only for GPU-configured servers?
A: It is sized for clearance in GPU SKU configurations but is otherwise matched to the UCS C225 M6 platform. Verify your specific build requirements.

Q: Can this be used on other UCS generations?
A: No. It is designed specifically for the UCS C225 M6. Use the generation- and model-specific heatsink for other platforms.

Technical Specifications

- Compatibility: UCS C225 M6
- Chassis support: 1U and 2U; LFF and SFF
- Profile: low-profile
- Intended build: GPU SKU configurations
- Cooling type: passive CPU heatsink
- Airflow orientation: front-to-back (rack-optimized)
- Installation: uses platform’s standard retention mechanism
- Package content: 1x heatsink

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