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Cisco

Cisco UCS-CPU-8160T | Platinum 8160T | 24C/48T | 2.1 GHz | 33MB L3 | 150W TDP | DDR4-2666 | LGA3647 | 3x UPI 10.4 GT/s | T-suffix high Tcase

SKU:UCS-CPU-8160T

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Description

Enterprise CPU for demanding environments requiring extended thermal characteristics. Balanced core count and frequency for mixed virtualization, application, and database roles on LGA3647 platforms.

Features

- 24 cores for high consolidation ratios
- High Tcase design for demanding thermal environments
- Six-channel DDR4-2666 with ECC for bandwidth and data integrity
- AVX-512 support for HPC and analytics acceleration
- Three UPI links for robust inter-socket connectivity

Warranty

All products sold by XS Network Tech include a 12-month warranty on both new and used items. Our in-house technical team thoroughly tests used hardware prior to sale to ensure enterprise-grade reliability.

All technical data should be verified on the manufacturer data sheets.

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Technical Specifications

FAQs

Technical Specifications

- Model: 8160T (1st Gen Scalable, Platinum series)
- Cores/Threads: 24 / 48
- Base Frequency: 2.1 GHz
- L3 Cache: 33 MB
- TDP: 150 W
- Memory Support: DDR4-2666, ECC RDIMM/LRDIMM, 6 channels
- Socket: LGA3647
- UPI: 3 links at 10.4 GT/s
- Instruction Set: 64-bit, AVX-512 capable
- Virtualization: Hardware virtualization and I/O virtualization support
- T-suffix: High Tcase variant for extended thermal requirements
- Platform Compatibility: Servers that support 81xx LGA3647 CPUs

FAQs

Q: What does the T-suffix mean on 8160T?
A: It indicates a high Tcase variant intended for extended thermal and operational conditions compared to the standard part.

Q: Is this suitable for dual-processor servers?
A: Yes, use in compatible multi-socket LGA3647 platforms with matching CPUs and current firmware.

Q: Which memory DIMMs are supported?
A: DDR4-2666 ECC RDIMM or LRDIMM. Effective speed and capacity depend on DIMM type and population rules.

Q: Is a heatsink included?
A: No heatsink is included unless stated. Use the server’s qualified heatsink/carrier assembly.

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