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Juniper

Juniper QFX5240-2U-FANAO | F2B fan module for 64x800G OSFP/QSFP-DD 2U chassis

SKU:QFX5240-2U-FANAO

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Description

Field-replaceable front-to-back airflow fan module engineered for high-density 800G data center switches. Ensures correct thermal directionality from the port side to the PSU side when paired with matching airflow power supplies. Designed specifically for the 2U 64x800G platforms, providing consistent cooling performance under sustained load.

Features

- Correct front-to-back thermal directionality for hot-aisle/cold-aisle deployments
- Fast, tool-less field replacement to minimize downtime
- Platform-matched design for 64x800G 2U chassis
- Stable cooling performance for sustained 800G workloads

Warranty

All products sold by XS Network Tech include a 12-month warranty on both new and used items. Our in-house technical team thoroughly tests used hardware prior to sale to ensure enterprise-grade reliability.

All technical data should be verified on the manufacturer data sheets.

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Technical Specifications

FAQs

Technical Specifications

- Airflow direction: Front-to-back (port-to-PSU)
- Compatibility: QFX5240-64OD (OSFP) and QFX5240-64QD (QSFP-DD) platforms
- Form factor: Fan module for 2U chassis
- Installation: Quick, tool-less insertion/removal via chassis latches
- Use case: Maintains correct thermal path for high-density 800G switching

FAQs

Q: Is this fan module compatible with both OSFP and QSFP-DD variants of the 64x800G platform?
A: Yes, it is designed for the 2U 64x800G platforms in both OSFP (64OD) and QSFP-DD (64QD) variants.

Q: Can I mix different airflow directions in the same chassis?
A: No. All cooling components (fans and PSUs) must use the same airflow direction to ensure proper thermal performance.

Q: How many fan modules are required for operation?
A: Refer to the platform documentation; all designated fan bays should be populated to maintain supported airflow and redundancy.

Q: Does this fan module include mounting hardware?
A: No extra hardware is required; the module uses the chassis’ built-in tool-less retention mechanism.

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