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HPE

HPE P58458-B21 | DL3X5 Gen11 2U Standard Heat Sink Kit | Thermal tier: Standard | CPU cooling for 2U DL3X5 Gen11

SKU:P58458-B21

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Description

Standard thermal solution for DL3X5 Gen11 2U servers, tailored for CPUs within standard TDP envelopes and balanced performance profiles. Ensures reliable cooling using system airflow with an efficient fin design and secure mounting.

Features

- Right-sized cooling for standard TDP CPUs
- Optimized fin geometry for efficient airflow in 2U chassis
- Validated fit for DL3X5 Gen11 platforms
- Quiet, efficient operation leveraging system fans
- Simple serviceability with platform-documented procedure

Warranty

All products sold by XS Network Tech include a 12-month warranty on both new and used items. Our in-house technical team thoroughly tests used hardware prior to sale to ensure enterprise-grade reliability.

All technical data should be verified on the manufacturer data sheets.

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FAQs

Technical Specifications

FAQs

Q: How do I choose between Standard, Performance, and Max Performance heat sinks?
A: Match the heat sink to your CPU TDP and workload. Standard suits typical TDP CPUs, Performance supports higher TDP parts or sustained loads, and Max Performance is for the highest TDP CPUs or thermally demanding environments.

Q: Does this include thermal interface material (TIM)?
A: The kit is designed to be installed with platform-appropriate TIM. Refer to the server service guide for TIM requirements and installation steps.

Q: Which servers are in the DL3X5 Gen11 family?
A: DL3X5 Gen11 refers to the DL3X5-series Gen11 2U rack servers. Check your exact model and service guide for confirmation before ordering.

Technical Specifications

- Product type: CPU heat sink kit
- Form factor: 2U chassis
- Platform compatibility: ProLiant DL3X5 Gen11 rack servers
- Thermal tier: Standard (for standard TDP processors)
- Cooling method: Passive heat sink leveraging system fans
- Installation: Tool-assisted secure mounting (platform-specific)
- Use case: General-purpose workloads with balanced thermals

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