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HPE

HPE P58456-B21 | 1U CPU standard heatsink for DL3X5 Gen11 (standard-TDP)

SKU:P58456-B21

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Description

Standard thermal solution for 1U DL3X5 Gen11 servers, optimized for CPUs within standard TDP ranges to maintain reliable performance in dense racks. Designed for precise mechanical fit and efficient heat transfer in 1U airflow-optimized chassis.

Features

- Validated fit for DL3X5 Gen11 1U platforms
- Optimized for standard TDP processors
- Efficient heat transfer for sustained performance
- Rack-optimized airflow design

Warranty

All products sold by XS Network Tech include a 12-month warranty on both new and used items. Our in-house technical team thoroughly tests used hardware prior to sale to ensure enterprise-grade reliability.

All technical data should be verified on the manufacturer data sheets.

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FAQs

Technical Specifications

FAQs

Q: When should I choose the standard heatsink?
A: Use the standard heatsink for processors within the platform’s standard TDP range and typical ambient conditions.

Q: Is thermal paste included?
A: A server-qualified thermal interface solution is included or required as per platform guidelines; follow installation instructions.

Q: Does it fit 2U servers?
A: This kit is designed for 1U DL3X5 Gen11 systems; use the platform-specific heatsink for other form factors.

Q: Do I need any additional brackets?
A: Required mounting hardware is platform-specific; use the kit as specified for DL3X5 Gen11 1U.

Technical Specifications

- Compatibility: DL3X5 Gen11 1U servers (e.g., DL325/345/365 Gen11)
- Cooling class: Standard thermal profile for standard-TDP CPUs
- Form factor: 1U-optimized heatsink
- Materials: High-efficiency fin stack with heatpipe/copper base (design dependent)
- Installation: Server-qualified mounting and retention hardware
- Airflow: Front-to-back orientation for rack environments
- Use case: General-purpose workloads in 1U chassis

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