Skip to product information
1 of 1

HPE

HPE P47224-B21 | ML350 Gen11 performance CPU heat sink kit | passive, high-airflow design for Intel Xeon Scalable

SKU:P47224-B21

Regular price POA
POA
POA
Sale Sold out
Taxes included. Shipping calculated at checkout.

Description

Performance heat sink kit for ML350 Gen11 servers, providing efficient passive CPU cooling using system airflow. Ideal when adding a second processor or upgrading to higher-performance CPUs. Includes heatsink assembly and mounting hardware for chassis-validated fit.

Features

- Platform-validated thermal solution for ML350 Gen11
- Passive, reliable operation with no moving parts
- Optimized fin geometry for high-airflow chassis
- Captive-screw mounting for secure, repeatable installs
- Supports performance CPU configurations and dual-processor builds

Warranty

All products sold by XS Network Tech include a 12-month warranty on both new and used items. Our in-house technical team thoroughly tests used hardware prior to sale to ensure enterprise-grade reliability.

All technical data should be verified on the manufacturer data sheets.

View full details
  • You may also like
  • Best sellers
  • Related Products

specs-tabs

Collapsible content

FAQs

Technical Specifications

FAQs

Q: Is this heatsink required for a second CPU in the ML350 Gen11?
A: Yes. A second CPU typically requires its own dedicated heatsink matched to the server platform.

Q: Does this include fans?
A: No. It is a passive heatsink; cooling airflow is provided by the server’s system fans.

Q: Can I use it with any ML350 Gen11 CPU?
A: It is designed for ML350 Gen11 Intel Xeon Scalable CPUs. Verify compatibility with your specific processor and chassis configuration.

Q: Do I need additional air baffles?
A: Follow the server’s installation guide; correct baffles and fan population are required to meet thermal specifications.

Technical Specifications

- Compatibility: ML350 Gen11 tower servers
- Function: CPU thermal solution for performance configurations
- Cooling type: Passive heatsink (uses system fans for airflow)
- Design: High-density fin stack with optimized airflow path
- Mounting: Captive-screw securement for tool-assisted install
- Use case: Required for second CPU installs or higher-TDP CPU upgrades
- Contents: Heatsink assembly and required mounting hardware
- Service note: Ensure proper air baffles and fan population for target TDP

Recently Viewed

  • Request for a Quote

    Looking for competitive pricing? Submit a request, and our team will provide a tailored quote that fits your needs.

  • Contact Us Directly

    Have a question or need immediate assistance? Call us for expert advice and real-time support.

    Call us Now  
  • Contact Us Directly

    Have a question or need immediate assistance? Call us for expert advice and real-time support.

    Contact us