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HPE

HPE P47223-B21 | ML350 Gen11 | Standard CPU heatsink kit | socket cooling solution for standard TDP

SKU:P47223-B21

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Description

Standard CPU heat sink kit for Gen11 tower configurations, providing the required cooling hardware for a processor socket in supported systems. Recommended for installations using standard TDP processors and ambient conditions specified by the platform.

Features

- Platform-validated cooling solution for processor installation
- Standard thermal design for balanced acoustics and performance
- Straightforward, service-friendly installation
- Ensures reliable CPU operation within supported thermal envelopes

Warranty

All products sold by XS Network Tech include a 12-month warranty on both new and used items. Our in-house technical team thoroughly tests used hardware prior to sale to ensure enterprise-grade reliability.

All technical data should be verified on the manufacturer data sheets.

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FAQs

Technical Specifications

FAQs

Q: Does this include thermal paste?
A: If a TIM pad is not pre-applied, you must apply an approved thermal compound during installation.

Q: How many do I need?
A: One heat sink per CPU socket populated with a processor.

Q: Is this suitable for high-TDP CPUs?
A: This is the standard heat sink. For higher-TDP processors, use the platform-recommended performance heat sink.

Q: Are any system fans included?
A: No. It relies on the server’s chassis fans for airflow.

Technical Specifications

- Type: standard processor heat sink (passive heat sink with chassis-managed airflow)
- Compatibility: ML350 Gen11 platforms (check system-specific CPU/TDP guidance)
- Use case: required when installing or replacing a CPU in the designated socket
- Thermal rating: suitable for standard TDP processors as per platform guidelines
- Contents: heat sink and mounting hardware
- Thermal interface: apply approved thermal compound if not pre-applied on the heat sink
- Fans: system fans are not included; uses chassis airflow
- Quantity required: one heat sink per installed CPU

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