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Cisco UCSX-GPU-MI210 | Instinct MI210 GPU, 64GB HBM2e, 300W, PCIe 4.0 x16

SKU:UCSX-GPU-MI210

Stock Status: Enquire

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Description

The Cisco UCSX-GPU-MI210 AMD Instinct MI210 accelerator delivers exceptional double-precision compute performance for HPC and AI workloads in enterprise data centers. Built on the AMD CDNA 2 architecture with 64GB HBM2e memory and 1.6 TB/s bandwidth, this passive-cooled PCIe Gen4 x16 GPU provides 45.3 TFLOPS FP64 matrix performance and 181 TFLOPS FP16/BF16 throughput. Designed for Cisco UCS X-Series modular systems, it supports multi-GPU scaling via AMD Infinity Fabric links for demanding scientific computing, deep learning, and simulation applications.

Features

AMD CDNA 2 architecture optimized for HPC and AI convergence workloads
- 64GB HBM2e memory with ECC protection for data integrity
- 45.3 TFLOPS FP64 matrix performance, over 2x competing PCIe accelerators
- 181 TFLOPS FP16/BF16 for mixed-precision deep learning training
- 6,656 stream processors with 416 AMD Matrix Cores
- 1.6 TB/s memory bandwidth for large dataset processing
- Up to three Infinity Fabric links for coherent multi-GPU scaling
- PCIe Gen4 x16 interface with Gen3 backward compatibility
- SR-IOV virtualization support for cloud and multi-tenant environments
- Full-chip ECC and RAS features for enterprise reliability
- Passive cooling design for integration in high-airflow chassis
- AMD ROCm open-source software ecosystem compatibility
- Dual-slot FHFL form factor for standard rack server deployment
- Native support for PyTorch, TensorFlow, and HPC application frameworks

Warranty

All products sold by XS Network Tech include a 12-month warranty on both new and used items. Our in-house technical team thoroughly tests used hardware prior to sale to ensure enterprise-grade reliability.

All technical data should be verified on the manufacturer data sheets.

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Technical Specifications

FAQs

Technical Specifications

GPU: AMD Instinct MI210 with CDNA 2 architecture
- Memory: 64GB HBM2e, 1.6TB/s bandwidth, 4096-bit interface, ECC support
- Compute Units: 104 CU with 6,656 stream processors and 416 matrix cores
- Performance: 45.3 TFLOPS FP64/FP32 matrix, 22.6 TFLOPS FP64/FP32 vector, 181 TFLOPS FP16/BF16
- Interconnect: Up to 3x AMD Infinity Fabric links for multi-GPU scaling
- Interface: PCIe Gen4 x16 (Gen3 backward compatible)
- Form Factor: Full-Height, Full-Length (FHFL), dual-slot, passive cooling
- Power: 300W TDP, 8-pin EPS12V connector
- Dimensions: 4.5" x 10.5" (11.43 cm x 26.67 cm)
- Software: AMD ROCm compatible, supports Linux 64-bit
- Features: SR-IOV support (passthrough only), full-chip ECC, RAS support
- Compatibility: Cisco UCS X440p PCIe Node with Riser Type A

FAQs

Q: Which Cisco UCS systems support the UCSX-GPU-MI210?
A: The UCSX-GPU-MI210 is designed for the Cisco UCS X-Series modular system, specifically the UCS X440p PCIe Node with Riser Type A. It requires PCIe Gen4 x16 connectivity and is deployed within the UCS X9508 chassis infrastructure. It is not compatible with the UCS X210c M6/M7 compute nodes.

Q: What workloads benefit most from the MI210 accelerator?
A: The MI210 excels in double-precision HPC applications including scientific simulations, computational fluid dynamics, molecular modeling, and finite element analysis. It also accelerates AI and machine learning workloads requiring large memory capacity, such as deep learning training with FP16/BF16 precision and large-scale data analytics.

Q: Can multiple MI210 GPUs be connected together?
A: Yes, the MI210 features up to three AMD Infinity Fabric links enabling direct GPU-to-GPU communication. In dual-GPU configurations, you can achieve 300GB/s aggregate bandwidth, and in quad-GPU configurations up to 600GB/s, allowing efficient scaling for multi-GPU HPC and AI workloads.

Q: What software and frameworks are compatible with the MI210?
A: The MI210 is compatible with AMD ROCm open-source software stack, which supports popular frameworks including PyTorch, TensorFlow, and various HPC applications. The HIP conversion tool assists in porting CUDA applications, and AMD Infinity Hub provides pre-optimized containers for common workloads.

Q: What are the power and cooling requirements?
A: The MI210 has a 300W TDP and uses an 8-pin EPS12V power connector. It features passive cooling design, requiring adequate server airflow for proper thermal management. The dual-slot FHFL form factor fits standard 2U GPU-capable server configurations with sufficient PCIe Gen4 x16 slot availability.

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