Cisco

Cisco UCSC-HSHP-C245M6 | High-profile CPU heatsink, C245 M6, 2U SFF, PCIe-optimized airflow

SKU:UCSC-HSHP-C245M6

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Description

Purpose-built high-profile CPU heatsink for C245 M6 2U SFF configurations, tuned for front-to-back rack airflow and dense PCIe builds. One heatsink is required per populated CPU socket; select the high-profile variant where specified by the server configuration guide.

Features

- High-profile design for improved clearance in PCIe-heavy builds
- Optimized for stable CPU thermals in 2U SFF servers
- Passive, reliable cooling with no moving parts
- Designed for consistent front-to-back data center airflow

Warranty

All products sold by XS Network Tech include a 12-month warranty on both new and used items. Our in-house technical team thoroughly tests used hardware prior to sale to ensure enterprise-grade reliability.

All technical data should be verified on the manufacturer data sheets.

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FAQs

Technical Specifications

FAQs

Q: Which systems is this heatsink compatible with?
A: It is intended for C245 M6 servers in 2U SFF configurations. Use the model-specific heatsink for other generations or chassis types.

Q: Do I need one per CPU?
A: Yes. A separate heatsink is required for each populated CPU socket.

Q: Is thermal paste included?
A: Thermal interface material may not be included. Plan to use approved TIM if it is not pre-applied on the heatsink.

Q: Can I use this in non-SFF or different airflow chassis?
A: No. This variant is optimized for the 2U SFF PCIe configuration; use the correct heatsink specified for other chassis or airflow patterns.

Technical Specifications

- Compatibility: C245 M6 (2U SFF)
- Form factor: High-profile (HSHP)
- Cooling type: Passive air-cooled heatsink
- Airflow: Front-to-back rack orientation
- Use case: PCIe-dense configurations in 2U SFF chassis
- Installation: One heatsink required per CPU socket
- Field-replaceable unit (FRU) for data center serviceability
- Thermal interface: Apply approved TIM if not pre-applied

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