Skip to product information
1 of 1

Cisco

Cisco UCS-CPU-I6326 | Gold 6326 CPU | 16-core | 2.9 GHz base | 24 MB L3 | 185W TDP | DDR4-3200

SKU:UCS-CPU-I6326

Regular price POA
POA
POA
Sale Sold out
Taxes included. Shipping calculated at checkout.

Description

Deliver balanced performance for virtualization, cloud, and enterprise workloads with the Gold 6326: 16 cores at 2.9 GHz base, 24 MB L3 cache, and a 185 W TDP with DDR4-3200 memory support. Ideal for dual-socket compute nodes needing strong per-core speed and scalability.

Features

- High per-core performance with 2.9 GHz base clock
- 16-core density for virtualization, databases, and cloud workloads
- DDR4-3200 support for high memory bandwidth
- Balanced 185W TDP for performance and efficiency in 2S servers

Warranty

All products sold by XS Network Tech include a 12-month warranty on both new and used items. Our in-house technical team thoroughly tests used hardware prior to sale to ensure enterprise-grade reliability.

All technical data should be verified on the manufacturer data sheets.

View full details
  • You may also like
  • Best sellers
  • Related Products

specs-tabs

Collapsible content

FAQs

Technical Specifications

FAQs

Q: Is this CPU compatible with my server?
A: It requires a platform designed for 3rd Gen Intel Xeon Scalable processors. Check your server’s CPU support list before purchase.

Q: Does it include a heatsink or cooling solution?
A: Tray processors typically do not include a cooler; cooling is provided by the server vendor. Verify your system configuration.

Q: What memory speed is supported?
A: It supports DDR4-3200; actual operating speed depends on the server platform and memory configuration.

Q: Can it be used in dual-socket systems?
A: Yes, it is designed for use in compatible dual-socket (2S) platforms. Consult your server’s documentation for CPU population rules.

Technical Specifications

- Processor series: Intel Xeon Scalable Gold 6300 (3rd Gen)
- Model: 6326
- Cores: 16
- Base frequency: 2.9 GHz
- L3 cache: 24 MB
- Thermal design power (TDP): 185 W
- Memory support: DDR4-3200
- Packaging: Tray
- Platform requirement: Server designed for 3rd Gen Intel Xeon Scalable processors

Recently Viewed

  • Request for a Quote

    Looking for competitive pricing? Submit a request, and our team will provide a tailored quote that fits your needs.

  • Contact Us Directly

    Have a question or need immediate assistance? Call us for expert advice and real-time support.

    Call us Now  
  • Contact Us Directly

    Have a question or need immediate assistance? Call us for expert advice and real-time support.

    Contact us