Cisco HX-GPU-P100-12G | Tesla P100 GPU Accelerator, 12GB HBM2, PCIe 3.0

Q: What Cisco systems is the HX-GPU-P100-12G compatible with?
A: This GPU accelerator is designed for Cisco HyperFlex HX-Series systems, including HX220c M5 and HX240c M5 nodes. It is compatible with Cisco UCS C-Series rack servers used in HyperFlex deployments. The card requires PCIe 3.0 x16 slots and BIOS configuration to support greater than 4GB memory-mapped I/O.

Q: What workloads benefit most from the Tesla P100?
A: The Tesla P100 excels at deep learning training and inference, scientific simulations, computational fluid dynamics, molecular modeling, seismic analysis, and financial risk modeling. With 3584 CUDA cores and high-bandwidth HBM2 memory, it accelerates parallel computing tasks that traditionally require large CPU clusters, delivering significantly faster time-to-solution for compute-intensive applications.

Q: What is HBM2 memory and why is it important?
A: High Bandwidth Memory 2 (HBM2) is an advanced memory technology that provides up to 549GB/s bandwidth in the 12GB P100 configuration, approximately 3x faster than traditional GDDR5. The 3072-bit memory interface and CoWoS chip-on-wafer stacking technology minimize data transfer bottlenecks, enabling the GPU to process large datasets efficiently for AI and HPC workloads.

Q: How many GPU cards can be installed in a HyperFlex node?
A: Cisco HyperFlex M5 and M6 nodes support up to two double-wide GPU cards in designated PCIe riser slots. When planning multi-GPU configurations, ensure all cards are the same model and verify adequate power supply capacity using the Cisco UCS power calculator, as each Tesla P100 requires 250W.

Q: Does the passive cooling design require special airflow?
A: Yes, passively cooled GPU cards rely on chassis airflow for heat dissipation. The card must be installed in rack servers with sufficient front-to-back airflow and proper ventilation. Ensure the operating temperature remains within 0°C to 45°C and that server fans are functioning correctly to prevent thermal throttling under sustained compute loads.