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Cisco

Cisco HX-CPU-I5218 | Xeon Gold 5218 | 16C/32T, 2.3 GHz base, 22 MB L3, 125W TDP, DDR4-2666 (6‑ch), LGA3647, 2nd Gen Scalable

SKU:HX-CPU-I5218

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Description

Balanced 16‑core data center CPU for dual‑socket platforms, ideal for virtualization, collaboration apps, and mid‑tier databases. Supports AVX‑512, DL Boost, ECC memory, and Optane DC Persistent Memory for larger in‑memory datasets.

Features

- 16 cores with Hyper‑Threading for high VM density
- AVX‑512 and DL Boost accelerate AI inference and HPC workloads
- Six‑channel ECC DDR4 memory for large in‑memory datasets
- 48 PCIe 3.0 lanes for high‑bandwidth I/O and NVMe
- Dual‑socket ready for scalable performance
- Support for Optane DC Persistent Memory to extend memory capacity

Warranty

All products sold by XS Network Tech include a 12-month warranty on both new and used items. Our in-house technical team thoroughly tests used hardware prior to sale to ensure enterprise-grade reliability.

All technical data should be verified on the manufacturer data sheets.

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FAQs

Technical Specifications

FAQs

Q: Is this CPU compatible with my server motherboard?
A: It requires an LGA3647 socket and BIOS/firmware support for 2nd Gen Xeon Scalable. Check your server’s CPU support list.

Q: Does it support Intel Optane DC Persistent Memory?
A: Yes, the 2nd Gen Xeon Scalable platform supports Optane DC Persistent Memory where the system board and firmware enable it.

Q: What memory speed does it support?
A: DDR4‑2666; actual operating speed depends on DIMM type, capacity, and population rules.

Q: Can I mix this CPU with a different Xeon model in a dual‑socket server?
A: Mixing different models/steppings is not recommended; matched processors are typically required for stability and performance.

Q: Is a heat sink included?
A: Cooling solutions are server‑specific; refer to your chassis or OEM for the correct heat sink and mounting kit.

Technical Specifications

- Model: Xeon Gold 5218 (2nd Gen Scalable, Cascade Lake)
- Cores / Threads: 16 / 32
- Base Frequency: 2.3 GHz
- Intel Smart Cache (L3): 22 MB
- TDP: 125 W
- Socket: LGA3647
- Memory Support: DDR4‑2666, 6 channels, ECC
- Max Memory Capacity: up to 1 TB per socket (platform dependent)
- PCIe: 48 lanes, PCIe 3.0
- UPI: 10.4 GT/s
- Key Technologies: Hyper‑Threading, Turbo Boost 2.0, AVX‑512, DL Boost (VNNI), Optane DC Persistent Memory support
- Scalability: Up to 2 sockets (platform dependent)

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