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Cisco HX-CPU-A7573X | EPYC 7573X | 32C/64T, 2.8/3.6 GHz, 768MB L3 3D V‑Cache, 280W TDP, SP3, DDR4-3200 8-ch, PCIe 4.0 x128, Zen 3 (Milan‑X)

SKU:HX-CPU-A7573X

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Description

High-cache EPYC 7573X delivers exceptional performance for cache‑sensitive databases, EDA/CFD, analytics, and HPC. Built on Zen 3 with 3D V‑Cache, it pairs high core density with massive L3 for lower memory latency and improved throughput in read‑intensive workloads. Compatible with SP3 platforms that support EPYC 7003 series BIOS/firmware.

Features

- Massive 768 MB L3 with 3D V‑Cache for cache‑heavy workloads
- 32 cores with Zen 3 IPC for balanced core density and per‑core speed
- 128 lanes PCIe 4.0 for high‑throughput I/O and accelerators
- 8‑channel DDR4‑3200 for high memory bandwidth
- Enterprise security with AMD Infinity Guard (SEV/SME)

Warranty

All products sold by XS Network Tech include a 12-month warranty on both new and used items. Our in-house technical team thoroughly tests used hardware prior to sale to ensure enterprise-grade reliability.

All technical data should be verified on the manufacturer data sheets.

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FAQs

Technical Specifications

FAQs

Q: Is the EPYC 7573X compatible with my server?
A: It requires an SP3 motherboard/server with BIOS/firmware support for EPYC 7003 (Milan/Milan‑X). Check your platform’s CPU support matrix.

Q: What workloads benefit most from the 3D V‑Cache?
A: Cache‑sensitive databases, EDA/CFD, FEA, HPC, and analytics that are bottlenecked by memory latency typically see strong gains.

Q: Can I mix this CPU with a different EPYC model in a dual‑socket system?
A: Mixing is not recommended. Dual‑socket platforms should use identical CPU models and steppings for stability and performance.

Q: What memory can I use?
A: Use ECC RDIMM or LRDIMM DDR4‑3200 modules supported by your server platform. Populate across 8 channels per socket for best bandwidth.

Technical Specifications

- Architecture: Zen 3 (Milan‑X)
- Cores / Threads: 32 / 64
- Base / Max Boost Clock: 2.8 GHz / up to 3.6 GHz
- Total L3 Cache: 768 MB (3D V‑Cache)
- TDP: 280 W
- Socket: SP3 (LGA 4094)
- Memory Support: 8‑channel DDR4‑3200 ECC RDIMM/LRDIMM
- Max Memory (per socket): up to 4 TB (platform dependent)
- PCI Express: 128 lanes, PCIe 4.0
- Process Technology: 7 nm
- Security: AMD Infinity Guard (SEV, SME, SEV‑ES)
- Virtualization: AMD‑V, IOMMU
- Platform Generation: EPYC 7003 series

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