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Vendor:NVIDIA
NVIDIA MSN3700-CS2FC | 32x100G QSFP28, No PoE, Uplinks: flexible via QSFP28 breakout (4x25G/2x50G), License: Cumulus Linux, Airflow: P2C
A dense 1U data center switch with 32x100GbE QSFP28 ports delivering true line‑rate L2/L3, ultra‑low latency, and hardware VXLAN/EVPN for scalable leaf/spine fabrics. Powered by Cumulus Linux for Linux-native operations, automation, and open networking. Port-to-chassis rear (P2C) airflow matches cold-aisle to hot-aisle deployments; dual hot-swap PSUs and N+1 fans ensure high availability. Ideal for leaf or spine roles with flexible breakout to 4x25G or 2x50G per port. -
Vendor:NVIDIA
NVIDIA MSN3700-CS2RC | 32x100G QSFP28, No PoE, Uplinks: flexible via QSFP28 breakout (4x25G/2x50G), License: Cumulus Linux, Airflow: C2P
A high-performance 1U data center switch with 32x100GbE QSFP28 ports providing line‑rate L2/L3, ultra‑low latency, and hardware VXLAN/EVPN for leaf/spine fabrics. Delivered with Cumulus Linux to enable automation-first operations and open networking. Chassis features C2P (rear-to-port) airflow for hot-aisle to cold-aisle deployments, redundant hot-swap PSUs, and N+1 fans. Suited for leaf, spine, or aggregation with flexible 4x25G/2x50G breakout per port. -
Vendor:NVIDIA
NVIDIA MSN3700-VS2FC | 32x200G QSFP56, No PoE, Uplinks: flexible via QSFP56 breakout (4x50G), License: Cumulus Linux, Airflow: P2C
A next‑gen 1U data center switch with 32x200GbE QSFP56 ports for ultra‑dense spine/leaf fabrics. It delivers line‑rate L2/L3, EVPN‑VXLAN offload, and very low latency, powered by Cumulus Linux for open, automated operations. This variant provides P2C (port-to-rear) airflow, dual hot-swappable PSUs, and N+1 fan redundancy. Ideal for 200G cores or 50G server access using 4x50G breakout per port. -
Vendor:NVIDIA
NVIDIA MSN3700-VS2RC | 32x200G QSFP56, No PoE, Uplinks: flexible via QSFP56 breakout (4x50G), License: Cumulus Linux, Airflow: C2P
A 1U, 32x200GbE QSFP56 switch built for modern EVPN‑VXLAN leaf/spine networks with line‑rate L2/L3 and ultra‑low latency. Delivered with Cumulus Linux for automation-first, open networking operations. This configuration uses C2P (rear-to-port) airflow with dual hot-swappable PSUs and N+1 fans for resilience and hot-aisle alignment. Ideal for 200G aggregation or 50G server access via 4x50G breakout. -
Vendor:NVIDIA
NVIDIA MSN4600-CS2FC | 64x100GbE QSFP28, non-PoE, 2U, dual PSUs, P2C airflow, Cumulus Linux, breakout 4x25G
MSN4600-CS2FC
Vendor:NVIDIANVIDIA MSN4600-CS2FC | 64x100GbE QSFP28, non-PoE, 2U, dual PSUs, P2C airflow, Cumulus Linux, breakout 4x25G
64-port 100GbE data center leaf/spine switch with QSFP28 interfaces, preloaded with Cumulus Linux for open, automated networking. P2C airflow aligns with cold-aisle to hot-aisle designs and the chassis includes dual hot-swap PSUs and rail kit. Supports line‑rate L2/L3, EVPN‑VXLAN, and congestion control for modern cloud fabrics. Flexible optics with QSFP28 SR4/LR4, DAC/AOC, and 4x25G breakouts. -
Vendor:NVIDIA
NVIDIA MSN4600-CS2RC | 64x100GbE QSFP28, non-PoE, 2U, dual PSUs, C2P airflow, Cumulus Linux, breakout 4x25G
MSN4600-CS2RC
Vendor:NVIDIANVIDIA MSN4600-CS2RC | 64x100GbE QSFP28, non-PoE, 2U, dual PSUs, C2P airflow, Cumulus Linux, breakout 4x25G
64-port 100GbE data center switch with QSFP28 interfaces, delivered with Cumulus Linux for automated, open networking. C2P airflow supports hot‑aisle to cold‑aisle requirements in specific rack layouts. Includes dual hot‑swap PSUs and rail kit, with line‑rate L2/L3, EVPN‑VXLAN, and modern congestion controls for cloud workloads. Compatible with QSFP28 SR4/LR4, DAC/AOC, and 4x25G breakouts. -
Vendor:NVIDIA
NVIDIA MSN4600-VS2FC | 64x200GbE QSFP56, non-PoE, 2U, dual PSUs, P2C airflow, Cumulus Linux, breakout 4x50G/2x100G
MSN4600-VS2FC
Vendor:NVIDIANVIDIA MSN4600-VS2FC | 64x200GbE QSFP56, non-PoE, 2U, dual PSUs, P2C airflow, Cumulus Linux, breakout 4x50G/2x100G
High-density 64-port 200GbE switch using QSFP56 interfaces for next‑gen spine/leaf fabrics. Ships with Cumulus Linux to enable EVPN‑VXLAN, automation, and open networking workflows. P2C airflow supports standard front‑to‑back cooling, and the chassis includes dual hot‑swap PSUs and rail kit. Flexible media options include QSFP56 optics plus 4x50G and 2x100G breakouts. -
Vendor:NVIDIA
NVIDIA MSN4600-VS2RC | 64x200GbE QSFP56, non-PoE, 2U, dual PSUs, C2P airflow, Cumulus Linux, breakout 4x50G/2x100G
MSN4600-VS2RC
Vendor:NVIDIANVIDIA MSN4600-VS2RC | 64x200GbE QSFP56, non-PoE, 2U, dual PSUs, C2P airflow, Cumulus Linux, breakout 4x50G/2x100G
64-port 200GbE QSFP56 switch for modern spine/leaf networks, delivered with Cumulus Linux to enable EVPN‑VXLAN and automation at scale. C2P airflow suits reverse‑cooled racks, and the chassis includes dual hot‑swap PSUs and rail kit. Supports QSFP56 optics plus flexible 4x50G and 2x100G breakouts for mixed‑speed deployments. -
Vendor:NVIDIA
NVIDIA MSN4700-WS2FC | 32x 400GbE QSFP-DD, 1U, Cumulus Linux, P2C airflow, dual PSU
MSN4700-WS2FC
Vendor:NVIDIANVIDIA MSN4700-WS2FC | 32x 400GbE QSFP-DD, 1U, Cumulus Linux, P2C airflow, dual PSU
High-density 400GbE data center switch with 32 QSFP-DD ports and Cumulus Linux for automation-friendly operations and EVPN/VXLAN fabrics. Fixed front (port) to rear (P2C) airflow variant with redundant, hot-swappable PSUs and fans; rail kit included for easy 19" rack mounting. Supports 400G optics, DAC/AOC cabling, and flexible port breakouts for leaf/spine deployments. -
Vendor:NVIDIA
NVIDIA MSN4700-WS2RC | 32x 400GbE QSFP-DD, 1U, Cumulus Linux, C2P airflow, dual PSU
MSN4700-WS2RC
Vendor:NVIDIANVIDIA MSN4700-WS2RC | 32x 400GbE QSFP-DD, 1U, Cumulus Linux, C2P airflow, dual PSU
High-density 400GbE data center switch with 32 QSFP-DD ports and Cumulus Linux for automation and EVPN/VXLAN. Rear-to-front (C2P) airflow variant suited for cold-aisle intake; includes redundant, hot-swappable PSUs and fans plus rack rail kit. Ideal for leaf/spine architectures with support for 400G optics and flexible breakouts. -
Vendor:NVIDIA
NVIDIA MTDF-BLK-F | Leaf slot blanking panel | preserves airflow & EMI containment | tool-less/captive fasteners | fits MCS85xx modular chassis
Blanking panel for unused leaf bays in MCS85xx modular chassis. Helps maintain optimal front-to-back airflow, supports thermal efficiency, and aids EMI containment while protecting open slots from dust and debris. Quick install and removal with captive or tool-less fasteners depending on chassis configuration. -
Vendor:NVIDIA
NVIDIA MTDF-CH-D | 800p cable holder | high-density cable routing | strain relief & bend-radius control | for MCS85xx chassis/racks
Cable management holder designed for high-density deployments around MCS85xx platforms. Provides organized routing, strain relief, and bend-radius control to protect cables and simplify service operations. Attaches to chassis or rack structures depending on configuration. -
Vendor:NVIDIA
NVIDIA MTDF-KIT-C | rack-mount rail kit | 19-inch EIA-310 | 4-post | for MCS85xx director chassis
MTDF-KIT-C
Vendor:NVIDIANVIDIA MTDF-KIT-C | rack-mount rail kit | 19-inch EIA-310 | 4-post | for MCS85xx director chassis
Rack-mount rail kit engineered for MCS85xx director chassis, enabling secure 19-inch EIA-310 4-post installation and easy service access. Includes rails and mounting hardware for standard data center racks. -
Vendor:NVIDIA
NVIDIA MTDF-LCD-A | 7-inch LCD service tablet | local status/management display | for MCS85xx director systems
7-inch LCD service tablet providing a local status and setup display for MCS85xx director systems. Ideal for quick commissioning, health checks, and onsite diagnostics where a direct service interface is required. -
Vendor:NVIDIA
NVIDIA MTDF-LIQ-A | director chassis water-cooling kit | for MCS85xx | closed-loop integration components
Water-cooling kit for MCS85xx director chassis, providing the components required to connect the chassis to a facility or row-based cooling loop as specified in the installation guide. Optimized for closed-loop circulation using PG25 coolant where recommended. -
Vendor:NVIDIA
NVIDIA MTDF-LIQ-B | PG25 coolant | 19 L container | for modular chassis water-cooling | 25% propylene glycol blend
PG25 coolant for modular chassis liquid-cooling systems supplied in a 19-liter container. Formulated at approximately 25% propylene glycol (PG25) per system guidance for thermal performance and materials compatibility.
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