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Vendor:Cisco
Cisco UCSC-HSLP-C245M6 | low-profile heatsink | UCS C245 M6 | 2U SFF GPU SKU | passive CPU cooling
UCSC-HSLP-C245M6
Vendor:CiscoCisco UCSC-HSLP-C245M6 | low-profile heatsink | UCS C245 M6 | 2U SFF GPU SKU | passive CPU cooling
Low-profile passive CPU heatsink for UCS C245 M6 servers, matched to 2U SFF GPU SKU configurations and designed for stable thermal performance with front-to-back airflow. Ideal as a platform-correct replacement for builds requiring GPU clearance. -
Vendor:Cisco
Cisco UCSC-HSLP-C225M8 | low-profile heatsink | UCS C225 M8 | passive CPU cooling
UCSC-HSLP-C225M8
Vendor:CiscoCisco UCSC-HSLP-C225M8 | low-profile heatsink | UCS C225 M8 | passive CPU cooling
Passive CPU heatsink purpose-built for UCS C225 M8 servers, maintaining low-profile clearance around expansion risers while supporting front-to-back rack airflow. Suitable as a direct replacement or for expansions requiring the correct thermal component for the platform. -
Vendor:Cisco
Cisco UCSC-HSLP-C225M6 | low-profile heatsink | UCS C225 M6 | 1U/2U LFF/SFF GPU SKU | passive CPU cooling
UCSC-HSLP-C225M6
Vendor:CiscoCisco UCSC-HSLP-C225M6 | low-profile heatsink | UCS C225 M6 | 1U/2U LFF/SFF GPU SKU | passive CPU cooling
Platform-matched passive CPU heatsink for UCS C225 M6 servers, sized for clearance in GPU-configured builds and optimized for front-to-back rack airflow across 1U/2U LFF/SFF chassis. Ideal as a replacement or for build-outs where correct thermal components are required for validated operation. -
Vendor:Cisco
Cisco UCSC-HSLP-C220M8 | Low-profile CPU heatsink, C220 M8 / C240 M8L & C240 M8 (GPU configs)
UCSC-HSLP-C220M8
Vendor:CiscoCisco UCSC-HSLP-C220M8 | Low-profile CPU heatsink, C220 M8 / C240 M8L & C240 M8 (GPU configs)
Low-profile CPU heatsink validated for C220 M8, C240 M8L, and C240 M8 GPU-configured builds. The compact profile preserves clearance while maintaining directed rack airflow across high-density add-in cards and GPU kits. -
Vendor:Cisco
Cisco UCSC-HSLP-C220M7 | Low-profile CPU heatsink, C220 M7, GPU-friendly airflow
UCSC-HSLP-C220M7
Vendor:CiscoCisco UCSC-HSLP-C220M7 | Low-profile CPU heatsink, C220 M7, GPU-friendly airflow
Low-profile CPU heatsink for C220 M7 platforms, designed to maintain proper airflow in dense or GPU-adjacent configurations. Ideal where vertical clearance is constrained and balanced chassis airflow is required across mixed add-in cards. -
Vendor:Cisco
Cisco UCSC-HSHP-C245M8 | High-profile CPU heatsink, C245 M8, rack-optimized airflow
UCSC-HSHP-C245M8
Vendor:CiscoCisco UCSC-HSHP-C245M8 | High-profile CPU heatsink, C245 M8, rack-optimized airflow
High-profile CPU heatsink engineered for C245 M8 platforms, supporting front-to-back rack airflow and high-performance CPU configurations. Install one heatsink per populated CPU socket; use only the specified variant for M8 platforms to ensure proper fit and airflow. -
Vendor:Cisco
Cisco UCSC-HSHP-C245M6 | High-profile CPU heatsink, C245 M6, 2U SFF, PCIe-optimized airflow
UCSC-HSHP-C245M6
Vendor:CiscoCisco UCSC-HSHP-C245M6 | High-profile CPU heatsink, C245 M6, 2U SFF, PCIe-optimized airflow
Purpose-built high-profile CPU heatsink for C245 M6 2U SFF configurations, tuned for front-to-back rack airflow and dense PCIe builds. One heatsink is required per populated CPU socket; select the high-profile variant where specified by the server configuration guide. -
Vendor:Cisco
Cisco UCSC-HSHP-C240M8 | C240 M8 CPU heatsink (no-GPU configs) | passive, chassis-fan cooled | 2U platform
UCSC-HSHP-C240M8
Vendor:CiscoCisco UCSC-HSHP-C240M8 | C240 M8 CPU heatsink (no-GPU configs) | passive, chassis-fan cooled | 2U platform
Platform-matched passive heatsink for C240 M8 2U systems configured without GPUs, aligned to the thermal design of non-GPU builds for reliable CPU cooling. Ideal as a service spare or when standardizing to validated configurations. -
Vendor:Cisco
Cisco UCSC-HSHP-C240M7 | C240 M7 CPU heatsink | 2U platform fit | passive, high-efficiency fin stack
UCSC-HSHP-C240M7
Vendor:CiscoCisco UCSC-HSHP-C240M7 | C240 M7 CPU heatsink | 2U platform fit | passive, high-efficiency fin stack
High-efficiency passive heatsink for C240 M7 2U platforms, tuned for the chassis airflow profile to maintain CPU thermal headroom under enterprise workloads. Suitable for replacement or configuration alignment to platform guidance. -
Vendor:Cisco
Cisco UCSC-HSHP-240M6 | C240 M6 2U SFF CPU heatsink | passive, chassis-fan cooled
UCSC-HSHP-240M6
Vendor:CiscoCisco UCSC-HSHP-240M6 | C240 M6 2U SFF CPU heatsink | passive, chassis-fan cooled
CPU heatsink tailored for C240 M6 2U SFF servers, designed to maintain processor thermals using the platform’s high-volume chassis airflow. Ideal for field replacement or ensuring the correct thermal profile in validated configurations. -
Vendor:Cisco
Cisco UCSC-HSHP-225M6 | C225 M6 1U SFF CPU heatsink | passive, chassis-fan cooled | PCIe configuration
UCSC-HSHP-225M6
Vendor:CiscoCisco UCSC-HSHP-225M6 | C225 M6 1U SFF CPU heatsink | passive, chassis-fan cooled | PCIe configuration
Purpose-built CPU heatsink for C225 M6 1U SFF servers in PCIe-configured builds, engineered to maintain processor thermals using the server’s chassis airflow. Ideal for service replacements or configuration changes requiring the correct thermal profile. -
Vendor:Cisco
Cisco UCSC-HS2-C240M5 | High-TDP CPU heatsink | UCS C240 M5 | >150W TDP | LGA3647 | passive
UCSC-HS2-C240M5
Vendor:CiscoCisco UCSC-HS2-C240M5 | High-TDP CPU heatsink | UCS C240 M5 | >150W TDP | LGA3647 | passive
High-performance CPU heatsink for UCS C240 M5 rack servers, supporting Intel Xeon Scalable processors with TDP above 150W. Provides robust thermal headroom in performance and memory-dense configurations using the server’s optimized airflow path. -
Vendor:Cisco
Cisco UCSC-HS2-C220M5 | High-TDP CPU heatsink | UCS C220 M5 | >150W TDP | LGA3647 | passive
UCSC-HS2-C220M5
Vendor:CiscoCisco UCSC-HS2-C220M5 | High-TDP CPU heatsink | UCS C220 M5 | >150W TDP | LGA3647 | passive
High-capacity CPU heatsink for UCS C220 M5 rack servers, designed for Intel Xeon Scalable processors with TDP above 150W. Ideal for performance configurations requiring enhanced heat dissipation while leveraging the server’s chassis airflow. -
Vendor:Cisco
Cisco UCSC-HS2-C125 | Rear-CPU heatsink | UCS C125 M5 server node | Intel Xeon Scalable (LGA3647) | passive
UCSC-HS2-C125
Vendor:CiscoCisco UCSC-HS2-C125 | Rear-CPU heatsink | UCS C125 M5 server node | Intel Xeon Scalable (LGA3647) | passive
Dedicated heatsink for the rear CPU position (CPU2) in UCS C125 M5 server nodes. Ensures proper thermal management and mechanical fit in dual-processor configurations using Intel Xeon Scalable CPUs. -
Vendor:Cisco
Cisco UCSC-HS-C3X60 | Server CPU heatsink | UCS C3X60 compute node | Intel Xeon Scalable (LGA3647) | passive, chassis-airflow cooled
Replacement CPU heatsink engineered for the UCS C3X60 server compute node, providing reliable thermal performance for Intel Xeon Scalable processors in enterprise environments. Designed to work with the system’s front-to-back airflow for quiet, efficient cooling. -
Vendor:Cisco
Cisco UCSC-HS-C240M5 | UCS C240 M5 | CPU heat sink | LGA3647 | Xeon Scalable | <=150W TDP
UCSC-HS-C240M5
Vendor:CiscoCisco UCSC-HS-C240M5 | UCS C240 M5 | CPU heat sink | LGA3647 | Xeon Scalable | <=150W TDP
Heatsink designed for UCS C240 M5 rack servers, supporting Intel Xeon Scalable processors up to 150W TDP. Aligns with system airflow and mounting to maintain CPU temperatures under sustained load.
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